Aluminum Nitride Packaging  

Ceramic Microchannels

 Powder injection molding materials & process design for high operating temperature packaging used in power semiconductors and LEDs

(R. Enneti, GTP and S.J Park, POSTECH)

Powder injection molding and green micromachining of ceramic microarrays for high temperature microreactors and fuel cells

(C. Wu, HP, B. Ozdoganlar, CMU)

Additional Areas: ultracapacitors, ceramic microturbines, sensors for sulphur compounds